Guangzhou GX Semiconductor, a key supplier of advanced packaging substrates, has begun construction on a new plant in the Huangpu district of Guangzhou, according to Chinese automotive news outlet Gasgoo. The project, which broke ground on September 29, is set to expand the company's production capacity for high-end FCBGA substrates used in data centers, high-performance computing (HPC), and cloud computing.
The first phase of the project covers an area of about 312 mu (roughly 20.8 hectares) with a total floor area of approximately 360,000 square meters. The facility will focus on producing high-grade FCBGA packaging substrates, a critical component in advanced semiconductor packaging that enables higher performance and integration for AI chips and other processors.
Strengthening the Regional Semiconductor Chain
Guangzhou GX Semiconductor, established in Huangpu in 2021, specializes in RF, FC-CSP, and FC-BGA substrates and has become a core supplier to several global top-tier packaging companies. The new project is seen as a strategic move to ramp up capacity in response to growing demand from the AI computing era.
Huangpu district has been building a comprehensive semiconductor ecosystem, now hosting over 150 integrated circuit companies. The district covers the full industrial chain from chip design and wafer fabrication to packaging, testing, equipment, materials, and terminal applications. Its PCB production capacity accounts for about one-tenth of the national total.
From January to August 2026, the district's semiconductor and integrated circuit industry output exceeded 31 billion yuan (about $4.37 billion), a year-on-year increase of 36.6%. This year, five major industrial projects each with investments of over 10 billion yuan have been launched in the district, including the fourth phase of CanSemi and projects by Rongjie.
The groundbreaking ceremony took place at the China-Singapore Guangzhou Knowledge City, a key hub for innovation and technology development in the region. The project is expected to further enhance Guangzhou GX Semiconductor's technological capabilities and production scale in the advanced packaging substrate segment.
